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Synopsys news12/22/2023 ![]() ![]() ![]() (Nasdaq: SNPS) today announced that its 3DIC Compiler unified 2.5D and 3D multi-die package co-design and co-analysis platform has been qualified for Samsung Foundry's Multi-Die Integration (MDI™) flow. ![]() 17, 2021 - To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance computing, AI and 5G, Synopsys, Inc. Mutual Customers Gain Full Exploration-to-Signoff 3DIC Solution to Manage Complexity of Hundreds of Billions of Transistors
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